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| MCP73861/2/3/4 Advanced Single or Dual Cell, Fully Integrated Li-Ion / Li-Polymer Charge Management Controllers Features * Linear Charge Management Controllers - Integrated Pass Transistor - Integrated Current Sense - Reverse-Blocking Protection * High-Accuracy Preset Voltage Regulation: + 0.5% * Four Selectable Voltage Regulation Options: - 4.1V, 4.2V - MCP73861/3 - 8.2V, 8.4V - MCP73862/4 * Programmable Charge Current: 1.2A Maximum * Programmable Safety Charge Timers * Preconditioning of Deeply Depleted Cells * Automatic End-of-Charge Control * Optional Continuous Cell Temperature Monitoring * Charge Status Output for Direct LED Drive * Fault Output for Direct LED Drive * Automatic Power-Down * Thermal Regulation * Temperature Range: -40C to +85C * Packaging: 16-Pin, 4 x 4 QFN 16-Pin SOIC Description The MCP7386X family of devices are highly advanced linear charge management controllers for use in spacelimited, cost-sensitive applications. The devices combine high-accuracy, constant voltage and current regulation, cell preconditioning, cell temperature monitoring, advanced safety timers, automatic charge termination, internal current sensing, reverse-blocking protection, charge status and fault indication in either a space-saving 16-pin, 4 x 4 QFN or 16-pin SOIC package. The MCP7386X provides a complete, fullyfunctional, stand-alone charge management solution with a minimum number of external components. The MCP73861/3 is intended for applications utilizing single-cell Lithium-Ion or Lithium-Polymer battery packs, while the MCP73862/4 is intended for dual series cell Lithium-Ion or Lithium-Polymer battery packs. The MCP73861/3 have two selectable voltageregulation options available (4.1V and 4.2V), for use with either coke or graphite anodes and operate with an input voltage range of 4.5V to 12V. The MCP73862/4 have two selectable voltage-regulation options available (8.2V and 8.4V), for use with coke or graphite anodes, and operate with an input voltage range of 8.7V to 12V. The only difference between the MCP73861/2 and MCP73863/4, respectively, is the function of the charge status output (STAT1) when a charge cycle has been completed. The MCP73861/2 flash the output, while the MCP73863/4 turn the output off. Refer to Section 5.2.1 "Charge Status Outputs (STAT1, STAT2)". The MCP7386X family of devices are fully specified over the ambient temperature range of -40C to +85C. Applications * * * * * * * Lithium-Ion/Lithium-Polymer Battery Chargers Personal Data Assistants (PDAs) Cellular Telephones Hand-Held Instruments Cradle Chargers Digital Cameras MP3 Players Package Types STAT1 VSS2 16-Pin QFN STAT2 16-Pin SOIC EN STAT2 1 STAT1 2 VSET 3 VDD1 4 VDD2 5 VSS1 6 PROG 7 THREF 8 16 EN 15 VSS2 14 VBAT3 13 VBAT2 12 VBAT1 11 VSS3 10 TIMER 9 THERM 16 15 14 13 VSET 1 VDD2 2 VDD2 3 VSS1 4 5 PROG 6 THREF 7 THERM 8 TIMER EP 17 12 VBAT3 11 VBAT2 10 VBAT1 9 VSS3 (c) 2008 Microchip Technology Inc. DS21893D-page 1 MCP73861/2/3/4 Typical Application 1.2A Lithium-Ion Battery Charger 5V 4.7F 2, 3 1 14 16 15 5 VDD VSET VBAT3 12 10, 11 V BAT 4.7 F THREF 6 EN 6.19 k STAT1 THERM 7 7.32 k STAT2 TIMER 8 0.1 4, 9, 13 F VSS PROG + Single Lithium-Ion - Cell Note: Pin numbers shown are for QFN package. Please refer to Section 6.0 "Applications" for details. MCP73861/3 Functional Block Diagram VDD1 VDD2 G = 0.001 4 k Direction Control VBAT1 VDD VBAT2 VREF 1 k PROG 11 k 90 k Charge Current Control Amplifier + - Voltage Control Amplifier + - VREF 110 k Charge Termination Comparator + - 10 k Precondition Control VREF + - - + VBAT3 600 k (1.65 M ) IREG/12 UVLO COMPARATOR Charge_OK Precon Precondition Comp. 10 k + - VUVLO EN Constant-Voltage/ Recharge Comp. 148.42 k Values in ( ) reflect the MCP73862/4 devices 1.58 k Power-On Delay VREF 300.04 k Bias and Reference Generator VUVLO VREF (1.2V) 10.3 k VSET (8.58 k) THREF 100 k Temperature Comparators Drv Stat 1 Control, IREG/12 Charge Timers Charge And Status Logic Drv Stat 2 Oscillator Charge_OK VSS1 VSS2 VSS3 STAT1 THERM 50 k + - + - STAT2 50 k TIMER DS21893D-page 2 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDDN ..............................................................................13.5V VBATN, VSET, EN, STAT1, STAT2 w.r.t. VSS .................................................................-0.3 to (VDD + 0.3)V PROG, THREF, THERM, TIMER w.r.t. VSS ..............-0.3 to 6V Maximum Junction Temperature, TJ ............ Internally Limited Storage temperature .....................................-65C to +150C ESD protection on all pins: Human Body Model (1.5 k in series with 100 pF).... 4 kV Machine Model (200 pF, No series resistance) ...........300V DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 12V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Supply Input Supply Voltage Supply Current UVLO Start Threshold VDD ISS VSTART 4.5 8.7 -- -- 4.25 8.45 UVLO Stop Threshold VSTOP 4.20 8.40 Voltage Regulation (Constant-Voltage Mode) Regulated Output Voltage VREG 4.079 4.179 8.159 8.358 4.1 4.2 8.2 8.4 4.121 4.221 8.241 8.442 V V V V MCP73861/3, VSET = VSS MCP73861/3,VSET = VDD MCP73862/4, VSET = VSS MCP73862/4, VSET = VDD VDD = [VREG(typ.) + 1V], IOUT = 10 mA TA = -5C to +55C Line Regulation Load Regulation Supply Ripple Attenuation |(VBAT/ VBAT)| /VDD |VBAT/VBAT| PSRR -- -- -- -- -- Output Reverse-Leakage Current Fast Charge Current Regulation IDISCHARGE -- 0.025 0.01 60 42 28 0.23 0.25 0.25 -- -- -- 1 %/V VDD = [VREG(typ.)+1V] to 12V IOUT = 10 mA % dB dB dB A IOUT = 10 mA to 150 mA VDD = [VREG(typ.)+1V] IOUT = 10 mA, 10 Hz to 1 kHz IOUT = 10 mA, 10 Hz to 10 kHz IOUT = 10 mA, 10 Hz to 1 MHz VDD < VBAT = VREG(typ.) -- -- 0.17 0.53 4.5 8.8 4.4 8.7 12 12 4 4 4.65 9.05 4.55 8.95 V V A mA V V V V MCP73861/3 MCP73862/4 Disabled Operating MCP73861/3 MCP73862/4 VDD Low-to-High MCP73861/3 MCP73862/4 VDD High-to-Low Sym Min Typ Max Unit s Conditions Current Regulation (Fast Charge Constant-Current Mode) IREG 85 1020 425 100 1200 500 115 1380 575 mA mA mA PROG = OPEN PROG = VSS PROG = 1.6 k TA= -5C to +55C (c) 2008 Microchip Technology Inc. DS21893D-page 3 MCP73861/2/3/4 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 12V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Sym Min Typ Max Unit s mA mA mA V V V V Conditions Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) Precondition Current Regulation IPREG 5 60 25 Precondition Threshold Voltage VPTH 2.70 2.75 5.40 5.50 Charge Termination Charge Termination Current ITERM 6 70 32 Automatic Recharge Recharge Threshold Voltage VRTH VREG 300 mV VREG 600 mV Thermistor Reference Thermistor Reference Output Voltage Thermistor Reference Source Current Thermistor Reference Line Regulation Thermistor Reference Load Regulation Thermistor Comparator Upper Trip Threshold Upper Trip Point Hysteresis Lower Trip Threshold Lower Trip Point Hysteresis Input Bias Current Sink Current Low Output Voltage Input Leakage Current Enable Input Input High Voltage Level Input Low Voltage Level Input Leakage Current VIH VIL ILK 1.4 -- -- -- -- 0.01 -- 0.8 1 V V A VENABLE = 12V VT1 VT1HYS VT2 VT2HYS IBIAS ISINK VOL ILK 1.18 -- 0.59 -- -- 4 -- -- 1.25 -50 0.62 80 -- 8 200 0.01 1.32 -- 0.66 -- 2 12 400 1 V mV V mV A mA mV A ISINK = 1 mA ISINK = 0 mA, VSTAT1,2 = 12V VTHREF 2.475 2.55 2.625 V TA = 25C, VDD = VREG(typ.) + 1V, ITHREF = 0 mA VREG 200 mV VREG 400 mV VREG -100 mV VREG 200 mV V V MCP73861/3 MCP73862/4 VBAT High-to-Low 8.5 90 41 11 120 50 mA mA mA PROG = OPEN PROG = VSS PROG = 1.6 k TA=-5C to +55C 10 120 50 2.80 2.85 5.60 5.70 15 180 75 2.90 2.95 5.80 5.90 PROG = OPEN PROG = VSS PROG = 1.6 k TA=-5C to +55C MCP73861/3, VSET = VSS MCP73861/3, VSET = VDD MCP73862/4, VSET = VSS MCP73862/4, VSET = VDD VBAT Low-to-High ITHREF |(VTHREF/ VTHREF)|/ VDD |VTHREF/ VTHREF| 200 -- -- 0.1 -- 0.25 A %/V VDD = [VREG(typ.) + 1V] to 12V % ITHREF = 0 mA to 0.20 mA 0.01 0.10 Status Indicator - STAT1, STAT2 DS21893D-page 4 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typ.) + 0.3V] to 12V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Thermal Shutdown Die Temperature Die Temperature Hysteresis TSD TSDHYS -- -- 155 10 -- -- C C Sym Min Typ Max Unit s Conditions AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters UVLO Start Delay Current Regulation Transition Time Out of Preconditioning Current Rise Time Out of Preconditioning Fast Charge Safety Timer Period Preconditioning Current Regulation Preconditioning Charge Safety Timer Period Charge Termination Elapsed Time Termination Period Status Indicators Status Output turn-off Status Output turn-on tOFF tON -- -- -- -- 200 200 s s ISINK = 1 mA to 0 mA ISINK = 0 mA to 1 mA tTERM 2.2 3 3.8 Hours CTIMER = 0.1 F tPRECON 45 60 75 Minutes CTIMER = 0.1 F tDELAY tRISE tFAST -- -- 1.1 -- -- 1.5 1 1 1.9 ms ms Hours VBAT < VPTH to VBAT > VPTH IOUT Rising to 90% of IREG CTIMER = 0.1 F Sym tSTART Min -- Typ -- Max 5 Units ms Conditions VDD Low-to-High TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (typ.) + 0.3V] to 12V. Typical values are at +25C, VDD = [VREG (typ.) + 1.0V] Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 16-lead, 4 mm x 4 mm QFN Thermal Resistance, 16-lead SOIC JA JA -- -- 47 86.1 -- -- C/W C/W 4-Layer JC51-7 Standard Board, Natural Convection 4-Layer JC51-7 Standard Board, Natural Convection TA TJ TA -40 -40 -65 -- -- -- +85 +125 +150 C C C Sym Min Typ Max Units Conditions (c) 2008 Microchip Technology Inc. DS21893D-page 5 MCP73861/2/3/4 NOTES: DS21893D-page 6 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. Battery Regulation Voltage (V) Battery Regulation Voltage (V) 4.207 4.205 4.203 4.201 4.199 4.197 4.195 4.193 10 100 Charge Current (mA) MCP73861/3 VSET = VDD VDD = 5.2V 4.207 4.205 4.203 4.201 4.199 4.197 4.195 4.193 MCP73861/3 VSET = VDD IOUT = 10 mA 1000 4.5 6.0 7.5 9.0 10.5 12.0 Supply Voltage (V) FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Charge Current (IOUT). Battery Regulation Voltage (V) FIGURE 2-4: Supply Current (ISS) vs. Charge Current (IOUT). 1.60 Supply Current (mA) MCP73861/3 VSET = VDD IOUT = 1000 mA 4.40 4.30 4.20 4.10 4.00 3.90 3.80 4.5 6.0 7.5 9.0 MCP73861/3 VSET = VDD IOUT = 1000 mA 1.40 1.20 1.00 0.80 0.60 0.40 10.5 12.0 4.5 6.0 7.5 9.0 10.5 12.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). Battery Regulation Voltage (V) FIGURE 2-5: Supply Current (ISS) vs. Supply Voltage (VDD). 1.00 Supply Current (mA) 4.207 4.205 4.203 4.201 4.199 4.197 4.195 4.193 MCP73861/3 VSET = VDD IOUT = 10 mA 0.90 0.80 0.70 0.60 0.50 0.40 MCP73861/3 VSET = VDD IOUT = 10 mA 4.5 6.0 7.5 9.0 10.5 12.0 4.5 6.0 7.5 9.0 10.5 12.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-3: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-6: Supply Current (ISS) vs. Supply Voltage (VDD). (c) 2008 Microchip Technology Inc. DS21893D-page 7 MCP73861/2/3/4 Typical Performance Curves (Continued) NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. Output Leakage Current (A) 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 +85C +25C -40C Supply Current (mA) MCP73861/3 VSET = VDD VDD = VSS 1.60 1.40 1.20 1.00 0.80 0.60 0.40 MCP73861/3 VSET = VDD IOUT = 10 mA -40 -30 -20 -10 0 10 20 30 40 50 60 60 60 70 70 70 2.0 2.4 2.8 3.2 3.6 4.0 4.4 Battery Regulation Voltage (V) Ambient Temperature (C) FIGURE 2-7: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT). Therm. Reference Voltage (V) FIGURE 2-10: Supply Current (ISS) vs. Ambient Temperature (TA). 2.550 2.540 2.530 2.520 2.510 2.500 Battery Regulation Voltage (V) 4.207 4.205 4.203 4.201 4.199 4.197 4.195 4.193 -40 MCP73861/3 VSET = VDD ITHREF = 100 A MCP73861/3 VSET = VDD IOUT = 10 mA -30 -20 -10 0 10 20 30 40 50 4.5 6.0 7.5 9.0 10.5 12.0 Supply Voltage (V) Ambient Temperature (C) FIGURE 2-8: Thermistor Reference Voltage (VTHREF) vs. Supply Voltage (VDD). Therm. Reference Voltage (V) FIGURE 2-11: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). Therm. Reference Voltage (V) 2.520 2.515 2.510 2.505 2.500 -40 -30 -20 -10 0 10 20 30 40 50 80 2.520 2.515 2.510 2.505 2.500 0 MCP73861/3 VSET = VDD MCP73861/3 VSET = VDD ITHREF = 100 A 25 50 75 100 125 150 175 200 Therm. Bias Current (A) Ambient Temperature (C) FIGURE 2-9: Thermistor Reference Voltage (VTHREF) vs. Thermistor Bias Current (ITHREF). FIGURE 2-12: Thermistor Reference Voltage (VTHREF) vs. Ambient Temperature (TA). DS21893D-page 8 (c) 2008 Microchip Technology Inc. 80 80 MCP73861/2/3/4 Typical Performance Curves (Continued) NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. Battery Regulation Voltage (V) 8.407 8.405 8.403 8.401 8.399 8.397 8.395 8.393 10 100 Charge Current (mA) 1000 Supply Current (mA) MCP73862/4 VSET = VDD VDD = 9.4V 1.00 0.90 0.80 0.70 0.60 0.50 0.40 MCP73862/4 VSET = VDD VDD = 9.4V 10 100 Charge Current (mA) 1000 FIGURE 2-13: Battery Regulation Voltage (VBAT) vs. Charge Currentt(IOUT). Battery Regulation Voltage (V) FIGURE 2-16: Supply Current (ISS) vs. Charge Current (IOUT). 1.60 8.407 MCP73862/4 VSET = VDD IOUT = 1000 mA 8.403 8.401 8.399 8.397 8.395 Supply Current (mA) 8.405 1.40 1.20 1.00 0.80 0.60 0.40 MCP73862/4 VSET = VDD IOUT = 1000 mA 8.393 10.0 10.4 10.8 11.2 11.6 12.0 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-14: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). Battery Regulation Voltage (V) 8.412 8.410 8.408 8.406 8.404 8.402 8.400 8.398 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Supply Voltage (V) MCP73862/4 VSET = VDD IOUT = 10 mA FIGURE 2-17: Supply Current (ISS) vs. Supply Voltage (VDD). 1.00 Supply Current (mA) 0.90 0.80 0.70 0.60 0.50 0.40 9.0 9.5 10.0 10.5 11.0 11.5 12.0 MCP73862/4 VSET = VDD IOUT = 10 mA Supply Voltage (V) FIGURE 2-15: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). FIGURE 2-18: Supply Current (ISS) vs. Supply Voltage (VDD). (c) 2008 Microchip Technology Inc. DS21893D-page 9 MCP73861/2/3/4 Typical Performance Curves (Continued) NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. Output Leakage Current (A) 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 4.0 4.8 5.6 6.4 7.2 8.0 8.8 +85C +25C -40C Supply Current (mA) MCP73862/4 VSET = VDD VDD = VSS 1.60 1.40 1.20 1.00 0.80 0.60 0.40 MCP73862/4 VSET = VDD IOUT = 10 mA 0 10 20 30 40 50 60 60 70 70 -40 -30 -20 Battery Regulation Voltage (V) FIGURE 2-19: Output Leakage Current (IDISCHARGE) vs. Battery Regulation Voltage (VBAT). Therm. Reference Voltage (V) 2.570 2.560 2.550 2.540 2.530 9.0 9.5 10.0 10.5 11.0 11.5 12.0 Supply Voltage (V) FIGURE 2-22: Supply Current (ISS) vs. Ambient Temperature (TA). Battery Regulation Voltage (V) 8.414 8.410 8.406 8.402 8.398 8.394 8.390 8.386 -40 -30 -20 -10 0 10 20 30 40 50 -10 Ambient Temperature (C) MCP73862/4 VSET = VDD ITHREF = 100 A MCP73862/4 VSET = VDD IOUT = 10 mA Ambient Temperature (C) FIGURE 2-20: Thermistor Reference Voltage (VTHREF) vs. Supply Voltage (VDD). Therm. Reference Voltage (V) 2.550 2.548 2.546 2.544 2.542 2.540 0 25 50 75 100 125 150 175 200 Thermistor Bias Current (A) MCP73862/4 VSET = VDD FIGURE 2-23: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). Therm. Reference Voltage (V) 2.550 2.546 2.542 2.538 2.534 2.530 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 MCP73862/4 VSET = VDD ITHREF = 100 A Ambient Temperature (C) FIGURE 2-21: Thermistor Reference Voltage (VTHREF) vs. Thermistor Bias Current (ITHREF). FIGURE 2-24: Thermistor Reference Voltage (VTHREF) vs. Ambient Temperature (TA). DS21893D-page 10 (c) 2008 Microchip Technology Inc. 80 80 MCP73861/2/3/4 Typical Performance Curves (Continued) NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. VDD VDD VBAT MCP73861 VDD Stepped from 5.2V to 6.2V IOUT = 500 mA COUT = 10 F, X7R, Ceramic VBAT MCP73861 VDD Stepped from 5.2V to 6.2V IOUT = 10 mA COUT = 10 F, X7R, Ceramic FIGURE 2-25: Line Transient Response. FIGURE 2-28: Line Transient Response. MCP73861 VDD 5.2V COUT = 10 F, X7R, Ceramic VBAT MCP73861 VDD 5.2V COUT = 10 F, X7R, Ceramic VBAT 100 mA IOUT 500 mA IOUT 10 mA 10 mA FIGURE 2-26: 0 -10 Attenuation (dB) -20 -30 -40 -50 -60 -70 -80 0.01 0.1 Load Transient Response. FIGURE 2-29: 0 -10 Attenuation (dB) -20 -30 -40 -50 -60 -70 -80 0.01 Load Transient Response. MCP73861 VDD = 5.2V VAC = 100 mVp-p IOUT = 10 mA COUT = 10 F, Ceramic MCP73861 VDD = 5.2V VAC = 100 mVp-p IOUT = 100 mA COUT = 10 F, X7R, Ceramic 1 10 100 1000 0.1 1 10 100 1000 Frequency (kHz) Frequency (kHz) FIGURE 2-27: Rejection. Power Supply Ripple FIGURE 2-30: Rejection. Power Supply Ripple (c) 2008 Microchip Technology Inc. DS21893D-page 11 MCP73861/2/3/4 Typical Performance Curves (Continued) NOTE: Unless otherwise indicated, VDD = [VREG(typ.) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. 1200 Charge Current (mA) 1000 800 600 400 200 0 OPEN MCP73861/2/3/4 VSET = VDD 505 Charge Current (A) 503 501 499 497 495 493 MCP73861/2/3/4 VSET = VDD RPROG = 1.6 k 0 10 20 30 40 50 60 70 -40 -30 -20 4.8k 1.6k 536 0 Programming Resistor () FIGURE 2-31: Charge Current (IOUT) vs. Programming Resistor (RPROG). FIGURE 2-32: Charge Current (IOUT) vs. Ambient Temperature (TA). -10 Ambient Temperature (C) DS21893D-page 12 (c) 2008 Microchip Technology Inc. 80 MCP73861/2/3/4 3.0 PIN DESCRIPTION PIN FUNCTION TABLE SOIC 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 2 - Symbol VSET VDD1 VDD2 VSS1 PROG THREF THERM TIMER VSS3 VBAT1 VBAT2 VBAT3 VSS2 EN STAT2 STAT1 EP Voltage Regulation Selection Battery Management Input Supply Battery Management Input Supply Battery Management 0V Reference Current Regulation Set Cell Temperature Sensor Bias Cell Temperature Sensor Input Timer Set Battery Management 0V Reference Battery Charge Control Output Battery Charge Control Output Battery Voltage Sense Battery Management 0V Reference Logic Enable Fault Status Output Charge Status Output Exposed Pad; Battery Management 0V Reference Function The descriptions of the pins are listed in Table 3.1. TABLE 3-1: QFN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 MCP73861/2/3/4 3.1 Voltage Regulation Selection (VSET) 3.5 Cell Temperature Sensor Bias (THREF) MCP73861/3: Connect VSET to VSS for 4.1V regulation voltage, connect to VDD for 4.2V regulation voltage. MCP73862/4: Connect VSET to VSS for 8.2V regulation voltage, connect to VDD for 8.4V regulation voltage. THREF is a voltage reference to bias external thermistor for continuous cell temperature monitoring and prequalification. 3.2 Battery Management Input Supply (VDD2, VDD1) 3.6 Cell Temperature Sensor Input (THERM) A supply voltage of [VREG (typ.) + 0.3V] to 12V is recommended. Bypass to VSS with a minimum of 4.7 F. THERM is an input for an external thermistor for continuous cell-temperature monitoring and prequalification. Connect to THREF/3 to disable temperature sensing. 3.3 Battery Management 0V Reference (VSS1, VSS2, VSS3) 3.7 Timer Set All safety timers are scaled by CTIMER/0.1 F. Connect to negative terminal of battery and input supply. 3.8 Battery Charge Control Output (VBAT1, VBAT2) 3.4 Current Regulation Set (PROG) Preconditioning, fast and termination currents are scaled by placing a resistor from PROG to VSS. Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to VSS with a minimum of 4.7 F to ensure loop stability when the battery is disconnected. (c) 2008 Microchip Technology Inc. DS21893D-page 13 MCP73861/2/3/4 3.9 Battery Voltage Sense (VBAT3) 3.12 Charge Status Output (STAT1) VBAT3 is a voltage sense input. Connect to positive terminal of battery. A precision internal resistor divider regulates the final voltage on this pin to VREG. STAT1 is a current-limited, open-drain drive for direct connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. 3.10 Logic Enable (EN) EN is an input to force charge termination, initiate charge, clear faults or disable automatic recharge. 3.13 Exposed Pad (EP) 3.11 Fault Status Output (STAT2) STAT2 is a current-limited, open-drain drive for direct connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. There is an internal electrical connection between the exposed thermal pad and VSS. The EP must be connected to the same potential as the VSS pin on the Printed Circuit Board (PCB). DS21893D-page 14 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 4.0 DEVICE OVERVIEW The MCP7386X family of devices are highly advanced linear charge management controllers. Refer to the functional block diagram. Figure 4-2 depicts the operational flow algorithm from charge initiation to completion and automatic recharge. With VSET tied to VSS, the MCP73861/3 and MCP73862/4 regulate to 4.1V and 8.2V, respectively. With VSET tied to VDD, the MCP73861/3 and MCP73862/4 regulate to 4.2V and 8.4V, respectively. 4.4 Charge Cycle Completion and Automatic Re-Charge 4.1 Charge Qualification and Preconditioning Upon insertion of a battery, or application of an external supply, the MCP7386X family of devices automatically performs a series of safety checks to qualify the charge. The input source voltage must be above the Undervoltage Lockout (UVLO) threshold, the enable pin must be above the logic-high level and the cell temperature must be within the upper and lower thresholds. The qualification parameters are continuously monitored. Deviation beyond the limits automatically suspends or terminates the charge cycle. The input voltage must deviate below the UVLO stop threshold for at least one clock period to be considered valid. Once the qualification parameters have been met, the MCP7386X initiates a charge cycle. The charge status output is pulled low throughout the charge cycle (see Table 5-1 for charge status outputs). If the battery voltage is below the preconditioning threshold (VPTH), the MCP7386X preconditions the battery with a tricklecharge. The preconditioning current is set to approximately 10% of the fast charge regulation current. The preconditioning trickle-charge safely replenishes deeply depleted cells and minimizes heat dissipation during the initial charge cycle. If the battery voltage has not exceeded the preconditioning threshold before the preconditioning timer has expired, a fault is indicated and the charge cycle is terminated. The MCP7386X monitors the charging current during the Constant-voltage regulation mode. The charge cycle is considered complete when the charge current has diminished below approximately 8% of the regulation current (IREG), or the elapsed timer has expired. The MCP7386X automatically begins a new charge cycle when the battery voltage falls below the recharge threshold (VRTH), assuming all the qualification parameters are met. 4.5 Thermal Regulation The MCP7386X family limits the charge current based on the die temperature. Thermal regulation optimizes the charge cycle time while maintaining device reliability. If thermal regulation is entered, the timer is automatically slowed down to ensure that a charge cycle will not terminate prematurely. Figure 4-1 depicts the thermal regulation profile. 1400 Maximum Charge Current (mA) 1200 1000 800 600 400 200 0 0 20 40 60 80 100 120 140 Die Temperature ( C) Minimum Maximum 4.2 Constant Current Regulation - Fast Charge Preconditioning ends, and fast charging begins, when the battery voltage exceeds the preconditioning threshold. Fast charge regulates to a constant current (IREG), which is set via an external resistor connected to the PROG pin. Fast charge continues until the battery voltage reaches the regulation voltage (VREG), or the fast charge timer expires; in which case, a fault is indicated and the charge cycle is terminated. FIGURE 4-1: Typical Maximum Charge Current vs. Die Temperature. 4.6 Thermal Shutdown 4.3 Constant Voltage Regulation When the battery voltage reaches the regulation voltage (VREG), constant voltage regulation begins. The MCP7386X monitors the battery voltage at the VBAT pin. This input is tied directly to the positive terminal of the battery. The MCP7386X selects the voltage regulation value based on the state of VSET. The MCP7386X family suspends charge if the die temperature exceeds 155C. Charging will resume when the die temperature has cooled by approximately 10C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry. (c) 2008 Microchip Technology Inc. DS21893D-page 15 FIGURE 4-2: Initialize DS21893D-page 16 Note 1 Yes Note 1 Temperature OK Yes No VBAT > VPTH Yes Yes Note 2 STAT1 = On STAT2 = Off No STAT1 = Off STAT2 = Flashing Charge Current = 0 No STAT1 = Off STAT2 = Off VDD > VUVLO EN High Constant-Current Mode Charge Current = IREG Reset Safety Timer Constant-Voltage Mode Output Voltage = VREG VBAT = VREG No Yes Yes Safety Timer Expired No Yes No STAT1 = Off STAT2 = On Fault Charge Current = 0 Reset Safety Timer Yes Yes IOUT < ITERM Elapsed Timer Expired No Temperature OK VDD < VUVLO VBAT < VRTH or EN Low Yes Yes Charge Termination Charge Current = 0 Reset Safety Timer VDD < VUVLO or EN Low Temperature OK No STAT1 = Off STAT2 = Flashing Safety Timer Suspended Charge Current = 0 No STAT1 = Flashing Safety Timer Suspended Charge Current = 0 No Yes STAT1 = Off STAT2 = Flashing Safety Timer Suspended Charge Current = 0 No STAT1 = Flashing (MCP73861/2) STAT1 = Off (MCP73863/4) STAT2 = Off (All Devices) Note 1: The qualification parameters are continuously monitored throughout the charge cycle. Refer to Section 4.1, "Charge Qualification and Preconditioning", for details. MCP73861/2/3/4 Note 2: The charge current will be scaled based on the die temperature during thermal regulation. Refer to Section 4.5, "Thermal Regulation", for details. Operational Flow Algorithm. Preconditioning Mode Charge Current = IPREG Reset Safety Timer VBAT > VPTH No Safety Timer Expired No (c) 2008 Microchip Technology Inc. Yes Temperature OK MCP73861/2/3/4 5.0 5.1 5.1.1 DETAILED DESCRIPTION Analog Circuitry BATTERY MANAGEMENT INPUT SUPPLY (VDD1, VDD2) Figure 6-1 depicts a typical application circuit with connection of the THERM input. The resistor values of RT1 and RT2 are calculated with the following equations. For NTC thermistors: 2 x R COLD x R HOT R T1 = ---------------------------------------------R COLD - R HOT 2 x R COLD x R HOT R T2 = ---------------------------------------------R COLD - 3 x R HOT For PTC thermistors: 2 x R COLD x R HOT R T1 = ---------------------------------------------R HOT - R COLD 2 x R COLD x R HOT R T2 = ---------------------------------------------R HOT - 3 x R COLD Where: RCOLD and RHOT are the thermistor resistance values at the temperature window of interest. Applying a voltage equal to VTHREF/3 to the THERM input disables temperature monitoring. The VDD input is the input supply to the MCP7386X. The MCP7386X automatically enters a Power-down mode if the voltage on the VDD input falls below the UVLO voltage (VSTOP). This feature prevents draining the battery pack when the VDD supply is not present. 5.1.2 PROG INPUT Fast charge current regulation can be scaled by placing a programming resistor (RPROG) from the PROG input to VSS. Connecting the PROG input to VSS allows for a maximum fast charge current of 1.2A, typically. The minimum fast charge current is 100 mA, set by letting the PROG input float. The following formula calculates the value for RPROG: 13.2 - 11 x I REG R PROG = ---------------------------------------12 x I REG - 1.2 Where: IREG = the desired fast charge current in amps. RPROG = measured in k. The preconditioning trickle-charge current and the charge termination current are scaled to approximately 10% and 8% of IREG, respectively. 5.1.5 TIMER SET INPUT (TIMER) The TIMER input programs the period of the safety timers by placing a timing capacitor (CTIMER) between the TIMER input pin and VSS. Three safety timers are programmed via the timing capacitor. The preconditioning safety timer period: C TIMER t PRECON = ------------------ x 1.0Hour s 0.1F The fast charge safety timer period: C TIMER t FAST = ------------------ x 1.5Hours 0.1F The elapsed time termination period: C TIMER t TERM = ------------------ x 3.0Hours 0.1F The preconditioning timer starts after qualification and resets when the charge cycle transitions to the fast charge, Constant-current mode. The fast charge timer and the elapsed timer start once the MCP7386X transitions from preconditioning. The fast charge timer resets when the charge cycle transitions to the Constant-voltage mode. The elapsed timer will expire and terminate the charge if the sensed current does not diminish below the termination threshold. During thermal regulation, the timer is slowed down proportional to the charge current. 5.1.3 CELL TEMPERATURE SENSOR BIAS (THREF) A 2.5V voltage reference is provided to bias an external thermistor for continuous cell temperature monitoring and prequalification. A ratio metric window comparison is performed at threshold levels of VTHREF/2 and VTHREF/4. 5.1.4 CELL TEMPERATURE SENSOR INPUT (THERM) The MCP73861/2/3/4 continuously monitors temperature by comparing the voltage between the THERM input and VSS with the upper and lower temperature thresholds. A negative or positive temperature coefficient, NTC or PTC thermistor and an external voltage-divider typically develop this voltage. The temperature sensing circuit has its own reference to which it performs a ratio metric comparison. Therefore, it is immune to fluctuations in the supply input (VDD). The temperature-sensing circuit is removed from the system when VDD is not applied, eliminating additional discharge of the battery pack. (c) 2008 Microchip Technology Inc. DS21893D-page 17 MCP73861/2/3/4 5.1.6 BATTERY VOLTAGE SENSE (VBAT3) The MCP7386X monitors the battery voltage at the VBAT3 pin. This input is tied directly to the positive terminal of the battery pack. The flashing rate (1 Hz) is based off a timer capacitor (CTIMER) of 0.1 F. The rate will vary based on the value of the timer capacitor. During a fault condition, the STAT1 status output will be off and the STAT2 status output will be on. To recover from a fault condition, the input voltage must be removed and then reapplied, or the enable input (EN) must be de-asserted to a logic-low, then asserted to a logic-high. When the voltage on the THERM input is outside the preset window, the charge cycle will not start, or will be suspended. The charge cycle is not terminated and recovery is automatic. The charge cycle will resume (or start) once the THERM input is valid and all other qualification parameters are met. During an invalid THERM condition, the STAT1 status output will be off and the STAT2 status output will flash. 5.1.7 BATTERY CHARGE CONTROL OUTPUT (VBAT1, VBAT2) The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP7386X provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack. 5.2 5.2.1 Digital Circuitry CHARGE STATUS OUTPUTS (STAT1, STAT2) Two status outputs provide information on the state of charge. The current-limited, open-drain outputs can be used to illuminate external LEDs. Optionally, a pull-up resistor can be used on the output for communication with a host microcontroller. Table 5-1 summarizes the state of the status outputs during a charge cycle. 5.2.2 VSET INPUT The VSET input selects the regulated output voltage of the MCP7386X. With VSET tied to VSS, the MCP73861/ 3 and MCP73862/4 regulate to 4.1V and 8.2V, respectively. With VSET tied to VDD, the MCP73861/3 and MCP73862/4 regulate to 4.2V and 8.4V, respectively. TABLE 5-1: CHARGE CYCLE STAT1 Qualification Preconditioning ConstantCurrent Fast Charge ConstantVoltage Charge Complete STATUS OUTPUTS (NOTE) STAT1 Off On On STAT2 Off Off Off 5.2.3 LOGIC ENABLE (EN) The logic enable input pin (EN) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle. Applying a logic-high input signal to the EN pin, or tying it to the input source, enables the device. Applying a logic-low input signal disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 0.17 A, typically. On Flashing (1 Hz, 50% duty cycle) (MCP73861/2) Off (MCP73863/4) Off Off (All Devices) On Flashing (1 Hz, 50% duty cycle) Off Off Fault THERM Invalid Disabled - Sleep mode Input Voltage Disconnected Note: Off Off Off Off Off state: Open-drain is high-impedance On state: Open-drain can sink current typically 7 mA Flashing: Toggles between off state and on state DS21893D-page 18 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 6.0 APPLICATIONS The MCP7386X is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP7386X provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage. . Figure 6-1 depicts a typical stand-alone application circuit, while Figures 6-2 and 6-3 depict the accompanying charge profile Unregulated Wall Cube VSET STAT1 16 1 2 3 4 STAT2 15 EN VSS2 14 13 12 VBAT3 VBAT2 VBAT1 VSS3 + Single - Lithium-Ion Cell VDD1 VDD2 VSS1 MCP73861 11 10 9 RT1 RT2 FIGURE 6-1: Typical Application Circuit. Preconditioning Mode Constant-Current Mode Constant-Voltage Mode Regulation Voltage (VREG) Regulation Current (IREG) Charge Voltage Transition Threshold (VPTH) Precondition Current (IPREG) Termination Current (ITERM) Precondition Safety Timer Fast Charge Safety Timer THERM THREF 5 PROG RPROG 6 7 8 TIMER CTIMER Charge Current Elapsed Time Termination Timer FIGURE 6-2: Typical Charge Profile. (c) 2008 Microchip Technology Inc. DS21893D-page 19 MCP73861/2/3/4 Preconditioning Mode Regulation Voltage (VREG) Regulation Current (IREG) Constant-Current Mode Constant-Voltage Mode Charge Voltage Transition Threshold (VPTH) Precondition Current (IPREG) Termination Current (ITERM) Precondition Safety Timer Fast Charge Safety Timer Elapsed Time Termination Timer Charge Current FIGURE 6-3: Typical Charge Profile in Thermal Regulation. 1200 mA is the maximum charge current obtainable from the MCP7386X. For this situation, the PROG input should be connected directly to VSS. 6.1 Application Circuit Design Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger. 6.1.1.2 Thermal Considerations The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is: PowerDissipation = ( V )xI DDMAX -V PTHMIN REGMAX 6.1.1 COMPONENT SELECTION Where: VDDMAX IREGMAX VPTHMIN = = = the maximum input voltage the maximum fast charge current the minimum transition threshold voltage Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process. 6.1.1.1 Current Programming Resistor (RPROG) The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life. DS21893D-page 20 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 Power dissipation with a 5V, 10% input voltage source is: PowerDissipation = ( 5.5V - 2.7V ) x 575mA = 1.61W 6.2 PCB Layout Issues With the battery charger mounted on a 1 in2 pad of 1 oz. copper, the junction temperature rise is 60C, approximately. This would allow for a maximum operating ambient temperature of 50C before thermal regulation is entered. For optimum voltage regulation, place the battery pack as close as possible to the device's VBAT and VSS pins, recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. 6.1.1.3 External Capacitors The MCP7386X is stable with or without a battery load. In order to maintain good AC stability in the Constantvoltage mode, a minimum capacitance of 4.7 F is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for up to a 1A output current. 6.1.1.4 Reverse-Blocking Protection The MCP7386X provides protection from a faulted or shorted input, or from a reversed-polarity input source. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor. 6.1.1.5 Enable Interface In the stand-alone configuration, the enable pin is generally tied to the input voltage. The MCP7386X automatically enters a Low-power mode when voltage on the VDD input falls below the UVLO voltage (VSTOP), reducing the battery drain current to 0.23 A, typically. 6.1.1.6 Charge Status Interface Two status outputs provide information on the state of charge. The current-limited, open-drain outputs can be used to illuminate external LEDs. Refer to Table 5-1 for a summary of the state of the status outputs during a charge cycle. (c) 2008 Microchip Technology Inc. DS21893D-page 21 MCP73861/2/3/4 NOTES: DS21893D-page 22 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 7.0 7.1 PACKAGING INFORMATION Package Marking Information 16-Lead QFN Example: 73861 I/ML 0831 256 XXXXXX XXXXXX YWWNNN XXXXX 16-Lead SOIC (150 mil) Example: XXXXXXXXXXXXX XXXXXXXXXXXXX YYWWNNN MCP73861 e3 I/SL^^ 0831256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2008 Microchip Technology Inc. DS21893D-page 23 MCP73861/2/3/4 /HDG 3ODVWLF 4XDG )ODW 1R /HDG 3DFNDJH 0/ [ [ 1RWH PP %RG\ >4)1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D EXPOSED PAD D2 e E E2 2 1 b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page 24 (c) 2008 Microchip Technology Inc. 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MCP73861/2/3/4 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ (c) 2008 Microchip Technology Inc. DS21893D-page 27 MCP73861/2/3/4 NOTES: DS21893D-page 28 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 APPENDIX A: REVISION HISTORY Revision D (December 2008) The following is the list of modifications: 1. Updated package outline diagrams. Revision C (August 2005) The following is the list of modifications: 1. 2. 1. Added MCP73863 and MCP73864 devices throughout data sheet. Added Appendix A: Revision History. Updated QFN and SOIC package diagrams. Revision B (December 2004) The following is the list of modifications: 1. Added SOIC package throughout data sheet. Revision A (June 2004) * Original Release of this Document. (c) 2008 Microchip Technology Inc. DS21893D-page 29 MCP73861/2/3/4 NOTES: DS21893D-page 30 (c) 2008 Microchip Technology Inc. MCP73861/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) b) c) d) MCP73861-I/ML: Single-Cell Controller 16LD-QFN package. MCP73861T-I/ML: Tape and Reel, Single-Cell Controller 16LD-QFN package. MCP73861-I/SL: Single-Cell Controller 16LD-SOIC package. MCP73861T-I/SL: Tape and Reel, Single-Cell Controller 16LD-SOIC package. Dual-Cell Controller 16LD-QFN package. MCP73862T-I/ML: Tape and Reel, Dual-Cell Controller 16LD-QFN package. MCP73862-I/SL: Dual-Cell Controller 16LD-SOIC package. MCP73862T-I/SL: Tape and Reel, Dual-Cell Controller 16LD-SOIC package. Single-Cell Controller 16LD-QFN package. MCP73863T-I/ML: Tape and Reel, Single-Cell Controller 16LD-QFN package. MCP73863-I/SL: Single-Cell Controller 16LD-SOIC package. MCP73863T-I/SL: Tape and Reel, Single-Cell Controller 16LD-SOIC package. Dual-Cell Controller 16LD-QFN package. MCP73864T-I/ML: Tape and Reel, Dual-Cell Controller 16LD-QFN package. MCP73864-I/SL: Dual-Cell Controller 16LD-SOIC package. MCP73864T-I/SL: Tape and Reel, Dual-Cell Controller 16LD-SOIC package. Device MCP73861: MCP73861T: MCP73862: MCP73862T: MCP73863: MCP73863T: MCP73864: MCP73864T: Single-Cell Charge Controller with Temperature Monitor Single-Cell Charge Controller with Temperature Monitor, Tape and Reel Dual Series Cells Charge Controller with Temperature Monitor Dual Series Cells Charge Controller with Temperature Monitor, Tape and Reel Single-cell Charge Controller with Temperature Monitor Single-Cell Charge Controller with Temperature Monitor, Tape and Reel Dual Series Cells Charge Controller with Temperature Monitor Dual Series Cells Charge Controller with Temperature Monitor, Tape and Reel +85C (Industrial) a) b) c) d) MCP73862-I/ML: Temperature Range Package I ML SL = -40C to a) = Plastic Quad Flat No Lead, 4x4 mm Body (QFN), 16-lead = Plastic Small Outline, 150 mm Body (SOIC), 16-lead b) c) d) MCP73863-I/ML: a) b) c) d) MCP73864-I/ML: (c) 2008 Microchip Technology Inc. DS21893D-page 31 MCP73861/2/3/4 NOTES: DS21893D-page 32 (c) 2008 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2008, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2008 Microchip Technology Inc. DS21893D-page 33 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 01/02/08 DS21893D-page 34 (c) 2008 Microchip Technology Inc. |
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